The Effect of Solder Paste Volume on Chip Resistor Solder Joint Fatigue Life
نویسندگان
چکیده
منابع مشابه
Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints
The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments such as those found in automotive and aerospace applications. This is due to a combination of the extreme temperature excursions experienced by the assemblies along with the large coefficient of thermal expansion mismatches between the al...
متن کاملEffect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint
Effect of holding time and temperature on the fatigue life of micro Sn-Ag-Cu solder joint has been studied with waveform of triangle and trapezoid wave at 298K and 398K. Both the microstructural coarsening and the crack propagation occurred simultaneously and therefore the cyclic load decreased rapidly in the trapezoidal wave at 398K compared with the other conditions. Therefore, under the cond...
متن کاملOn the effect of KIRKENDALL voids on solder joint reliability
A model for the theoretical description of KIRKENDALL voiding is presented based on vacancy diffusion and plastic deformation of spherical voids. We start with a phenomenological explanation of the KIRKENDALL phenomenon and discuss its consequences on microelectronic reliability. After that a constitutive model for void growth is introduced, which, for instances, can be used in order to predict...
متن کاملSolder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic Sn...
متن کاملEndoscopic Inspection of Solder Joint Integrity in Chip Scale Packages
This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspect...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Procedia Manufacturing
سال: 2019
ISSN: 2351-9789
DOI: 10.1016/j.promfg.2020.01.151